Introduction to 3D Measurement and Inspection Solution

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What Is the 3D Measurement and Inspection Solution?

Based on the Mech-Eye 3D Laser Profiler and Mech-MSR 3D measurement and inspection software developed by Mech-Mind, the 3D measurement and inspection solution provides various typical 3D measurement and inspection applications such as 3D geometric measurement, height measurement, 3D defect inspection, and object counting. This solution is applicable to consumer electronics, EV battery, automobile, photovoltaic and other industries.

System Components of the 3D Measurement and Inspection Solution

The 3D measurement and inspection solution consists of the following components:

system overview all

3D Laser Profiler

Mech-Eye 3D Laser Profiler (“laser profiler”) is the 3D laser profiler developed by Mech-Mind and can output high-quality intensity images, depth maps, and point clouds. Together with Mech-MSR, it can be deployed for various 3D measurement and inspection applications.

  • The laser profiler consists of a controller and sensor head.

  • The laser profiler can be powered by a DIN rail power supply.

Industrial Personal Computer (IPC)

The computer that provides the operating environment for the Mech-Mind’s software products.

You can use the standard IPC provided by Mech-Mind (recommended) or use your own device as the IPC. For more information about the IPC, refer to Select IPC Model.

Mech-Mind’s Software Products

Mech-Mind’s software products perform 3D measurement or inspection based on the data (intensity image, depth map, and point cloud) acquired by the laser profiler, and output the measurement or inspection results to an external device.

In this article, the laser profiler, IPC and Mech-Mind software products (Mech-Eye Viewer and Mech-MSR) provided by Mech-Mind constitute the Mech-Mind 3D Measurement System.

The Mech-Mind 3D Measurement System mainly involves the following software:

  • Mech-Eye Viewer

    Mech-Eye Viewer, installed on the IPC, is the configuration and data visualization software for laser profilers. It allows users to adjust the parameters of the laser profiler according to the characteristics of the target object, thus obtaining high-quality intensity images, depth maps, and point clouds simply and quickly.

  • Mech-MSR

    Mech-MSR, installed on the IPC, is a professional 3D measurement and inspection software. It can work with the laser profiler to deploy various 3D measurement and inspection applications, such as 3D geometric measurement, height measurement, 3D defect inspection, and object counting. The software has various built-in measurement algorithms and features, and it boasts a user-friendly interface. Users can apply the software to rapidly achieve one-stop, end-to-end deployment of applications.

Workflow of 3D Measurement and Inspection Applications

The general workflow of a 3D measurement and inspection application is shown in the figure below:

system overview application workflow

  1. When the target object moves in place, an external device (such as a photoelectric sensor) sends a signal to trigger data acquisition.

  2. After receiving the signal, the laser profiler acquires data of the object according to the parameters set through Mech-Eye Viewer, and generates the depth map, intensity image, and point cloud.

  3. An external device triggers the measurement project to run. Mech-MSR performs measurement based on the acquired data, determines the quality of the measurement, and outputs the measurement result.

  4. An external device obtains the measurement result from the 3D measurement system and performs subsequent processing based on the measurement result.

Application Scenarios of the 3D Measurement and Inspection Solution

  • 3D geometric measurement

    Measure the dimensions, step height, and spacing of the battery cell terminals. Regardless of the texture, reflectivity or color of the target object, the solution can perform stable measurements.

    system overview typical scenario 1

  • Height measurement

    Measure the heights of connector pins relative to the surface of the connector. Even though the tip of the pin is extremely small, the solution can perform stable measurements.

    system overview typical scenario 2

  • Flatness inspection

    The flatness of smartphone mid-plates is a key factor in product quality. The solution can rapidly evaluate the flatness of the mid-plates.

    system overview typical scenario 3

  • Hole locating

    Quickly locate the holes on the target objects and measure the hole diameters to ensure that the shape, dimensions, and positions of the mounting holes on stamped parts are correct.

    system overview typical scenario 4

  • 3D defect inspection

    Extract the change points of height from the depth map, and detect the presence of defects and defect patterns such as skewness, depression, and protrusion on the surface using the height information.

    system overview typical scenario 5

  • Object counting

    Count product items of different shapes and sizes in real time on high-speed production lines.

    system overview typical scenario 6

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